NF-300H TEOS equipment is independently researched and developed by Piotech, while undertaking the "11th Five-Year Plan" National Key Projects. It is used in the production of 128 layer and above 3D NAND flash chips. It can realize SiO2 and SiN (ONON) multilayer film stack structure, and thick TEOS film. The design achieved technological breakthroughs in film uniformity and roughness, film stress and particle control, and in productivity.
- High productivity design with fast switching between multiple types of thin film deposition
- Multi-layer SiO2 and SiN (ONON) stacking function can be realized
- Meet the requirements of high temperature deposition at 300-600 ℃
- The process chamber can be used for multiple wafer deposition
- Passed S2 safety certification