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The first 3D NAND equipment of Piotech leave the factory

Date:2017年1月6日 19:48

Abstract:

            On December 20, 2016, the first national 3D NAND PECVD equipment developed by Piotech leave the factory to client for checking.

As for undertaking the national mission, engineers of Piotech developed the PECVD equipment meeting the 3D NAND flash memory technology taking less than a year of research and development. 3D NAND PECVD equipment adopts special reaction cavity design and unique technique of pneumatic system, imported high temperature ceramic heating plate, realized the high temperature deposition, completed the oxidation silicon/silicon nitride/oxidation silicon/silicon nitride (ONON) stacked membrane technology development, and realized the alternate deposition of high-quality films by precision control for stacking nanoscale film thickness. After the 66000 marathon transmission reliability evaluation, technical indicators can meet the demand. This marks a breakthrough for high-end equipment in China.

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