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  • Product Name: 12-inch ALD equipment
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The FT-300T series

       FT-300Tseries are atomic layer deposition (ALD) equipments designed by Piotech. They can be adapted to high through put platform, to meet the requirements of high output for ALD process. FT-300T series can be applied to production line of VLSI (very large scale integrated circuit), Thin film encapsulation (TFE) processes of OLED industry, and TSV technology for advanced packaging. In ALD technology, only one layer of target materials will be deposited on the substrate in one cycle,So it can be used in ultra thin film deposition in deep trench with high AR. The FT-300T series ALD equipments are able to deposit high quality SiO, SiN, and Al2O3 ultra thin films, and Piotech will continue to explore the MO films (M= Metal) and metal nitrides films with FT-300T.

 

Precise control on film thickness through cycle time settings.

Excellent film uniformity and conformity.

 

Both Plasma Enhanced ALD (PECVD) and Thermal ALD configurations available

 

Above 95% step coverage on high aspect ratio structures (AR:44:1, opening: 50 nm)